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hlmp-egxx, hlmp-elxx new t-1? (5mm) extra high brightness alingap led lamps data sheet features ? f viewing fangle:f5,f23,f30 ? f high fluminousfoutput ? colors: f 590nm f amber f 626nm f red ? package foptions: f with forfwithoutfleadfstandof ? superior f resistancef tof moisture ? untinted f forf5,f23fandf30flamps applications ? trafc f management: -f trafc f signals -f pedestrian f signals -f work f zonef warningf lights -f variable fmessagef signs ? f solar f powerf signsf ? f commercial f outdoorf advertising -f signs -f marquees description these f precision f opticalf performance f alingap f ledsf provide f superior f light f outputf for f excellent f readability f inf sunlight f andf are f extremely f reliable. f alingap f ledf tech - nologyf provides f extremely f stablef light f outputf over f longf periods f off time. f precision f opticalf performance f lampsf utilize f thef aluminumf indiumf galliumf phosphidef (alingap) f technology. f these f ledf lampsf are f untinted, f t- ?f packages f incorpo - rating f second f generation f opticsf producing f well f defnedf spatial f radiationf patternsf atfspecifcfviewingf conef angles. these f lampsf are f madef withf anf advanced f opticalf grade f epoxy f ofering f superior f highf temperature f andf highf moisture f resistance f performance f inf outdoor f signal f andf sign f application. f the f maximumf ledf junction f tempera - ture f limitf off +30cf enablesf highf temperature f operation f inf bright f sunlight f conditions. f the f epoxy f contains f bothf uv-a f andf uv-b f inhibitors f to f reduce f thef efects f off longf term f exposuref tof directf sunlight. benefts ? superior f performancef forf outdoorf environments ? suitablef forf auto-insertionf ontofpcf board
2 package dimension a: non-standof b: standof viewing angle d 5 2.390.25 (0.4760.00) 23f&ff30 .960.25 (0.4590.00) notes: .f allfdimensionsf arefinf millimetersf(inches)f 2.f leads f arefmildf steelfwithftinf plating. 3.f the f epoxyfmeniscusfisf.2mmfmax 4.f for f identifcation f off polarity f after f thef leadsf are f trimmed f of, f pleasef refer f to f thef illustration f below: c a t h o d e a n o d e 1 . 1 4 0 . 2 0 ( 0 . 0 4 5 0 . 0 0 8 ) 5 . 8 0 0 . 2 0 ( 0 . 2 2 8 0 . 0 0 8 ) 3 1 . 6 0 ( 1 . 2 4 4 ) m i n . 0 . 7 0 ( 0 . 0 2 8 ) m a x . 1 . 0 0 ( 0 . 0 3 9 ) m i n . 8 . 7 1 0 . 2 0 ( 0 . 3 4 3 0 . 0 0 8 ) 2 . 5 4 0 . 3 8 ( 0 . 1 0 0 0 . 0 1 5 ) 0 . 5 0 0 . 1 0 ( 0 . 0 2 0 0 . 0 0 4 ) s q . t y p . c a t h o d e l e a d 2 . 3 5 ( 0 . 0 9 3 ) m a x . c a t h o d e f l a t 1 . 1 4 0 . 2 0 ( 0 . 0 4 5 0 . 0 0 8 ) 5 . 8 0 0 . 2 0 ( 0 . 2 2 8 0 . 0 0 8 ) 3 1 . 6 0 ( 1 . 2 4 4 ) m i n . 0 . 7 0 ( 0 . 0 2 8 ) m a x . 1 . 0 0 ( 0 . 0 3 9 ) m i n . 8 . 7 1 0 . 2 0 ( 0 . 3 4 3 0 . 0 0 8 ) 2 . 5 4 0 . 3 8 ( 0 . 1 0 0 0 . 0 1 5 ) 0 . 5 0 0 . 1 0 ( 0 . 0 2 0 0 . 0 0 4 ) s q . t y p . c a t h o d e l e a d c a t h o d e f l a t d 1 . 5 0 0 . 1 5 ( 0 . 0 5 9 0 . 0 0 6 ) 5 . 0 0 0 . 2 0 ( 0 . 1 9 7 0 . 0 0 8 ) 5 . 0 0 0 . 2 0 ( 0 . 1 9 7 0 . 0 0 8 )
3 device selection guide typical viewing angle 2 1/2 (deg) [4] color and dominant wavelength (nm), typ [3] lamps without standof on leads (package drawing a) lamps with standof on leads (package drawing b) luminous intensity iv (mcd) [1,2,5] at 20 ma min max 5 amber f590 hlmp-el a-zkdd hlmp-el b-zkdd 2000 2000 hlmp-el a-zldd hlmp-el b-zldd 2000 2000 red ff626 hlmp-eg a-z0dd hlmp-eg b-z0dd 2000 2000 23 amber f590 hlmp-el2a-xykdd hlmp-el2b-xykdd 7200 2000 hlmp-el2a-xyldd hlmp-el2b-xyldd 7200 2000 red ff626 hlmp-eg2a-xy0dd hlmp-eg2b-xy0dd 7200 2000 30 amber f590 hlmp-el3a-vwkdd hlmp-el3b-vwkdd 4200 7200 hlmp-el3a-vwldd hlmp-el3b-vwldd 4200 7200 hlmp-el3a-wxkdd hlmp-el3b-wxkdd 5500 9300 hlmp-el3a-wxldd hlmp-el3b-wxldd 5500 9300 red ff626 hlmp-eg3a-vw0dd hlmp-eg3b-vw0dd 4200 7200 hlmp-eg3a-wx0dd hlmp-eg3b-wx0dd 5500 7200 notes: .f thefluminousf intensityfisf measuredfonfthefmechanicalfaxisfofftheflampf packagefandfitfisf testedfwithfpulsingf condition. 2.f the fopticalfaxisfisfcloselyf alignedfwithfthef packagefmechanicalf axis. 3.f dominant f wavelength,f d ,fisf derivedf fromfthefcief chromaticityf diagramfandf representsfthef colorfoffthef lamp. 4.f ? fisfthefof-axisfanglef wherefthefluminousf intensityfisfhalffthefon-axisf intensity.f 5.f tolerance f forfeachfbinflimitfisff5% part numbering system note: f pleasef referf tofabf5337f forf completef informationfonf partf numberingf system. h l m p ? e x x x - x x x x x m e c h a n i c a l o p t i o n s d d : a m m o p a c k c o l o r b i n s e l e c t i o n s 0 : f u l l c o l o r d i s t r i b u t i o n k : c o l o r b i n 2 & 4 l : c o l o r b i n 4 & 6 m a x i m u m i n t e n s i t y b i n 0 : n o m a x i m u m i n t e n s i t y l i m i t ( r e f e r t o s e l e c t i o n g u i d e ) m i n i m u m i n t e n s i t y b i n v i e w i n g a n g l e a n d l e a d s t a n d o f f s 1 a : 1 5 w i t h o u t l e a d s t a n d o f f 1 b : 1 5 w i t h l e a d s t a n d o f f 2 a : 2 3 w i t h o u t l e a d s t a n d o f f 2 b : 2 3 w i t h l e a d s t a n d o f f 3 a : 3 0 w i t h o u t l e a d s t a n d o f f 3 b : 3 0 w i t h l e a d s t a n d o f f c o l o r g : r e d 6 2 6 n m l : a m b e r 5 9 0 n m r e f e r t o d e v i c e s e l e c t i o n g u i d e
4 electrical / optical characteristics t j f=f25c parameter symbol min typ. max units test conditions forward f voltage ffffff amber ffffff red v f .8 .8 2. 2. 2.4 2.4 v i f f=f20fma reverse f voltage v r 5 v i r f=f00fa dominant f wavelength f[] ffffff amber ffffff red l d 584.5 68.0 590.0 626.0 594.5 630.0 nm i f f=f20fma peak f wavelength ffffff amber ffffff red l peak 594 634 nm peak foff wavelength foff spectralf distribution f atfi f f=f20fma spectral fhalfwidth ffffff amber ffffff red l /2 3 4 nm i f f=f20fma thermal f resistance r q j-pin 240 c/w ledf junctionf tofanodeflead luminous f efcacy f[2] ffffff amber ffffff red v 500 200 lm/w emitted f luminousf flux/emittedf radiant f flux luminous f flux ffffff amber ffffff red v 2000 900 mlm i f f=f20fma luminous f efciency f[3] ffffff amber ffffff red e 47 45 lm/w emitted f luminousf flux/electricalf power thermal f coefcientfoff l d ffffff amber ffffff red 0.08 0.05 nm/c i f f=f20fmaf;f+25cff t j ff+00c notes: .f thef dominant f wavelength, f d f isf derived f from f thef cief chromaticity f diagram f referenced f to f illuminant f e. f tolerance f for f eachf color f off dominant f wavelength fisf+/-f0.5nm. 2.f the f radiant f intensity, f i e f inf watts f perf steradian, f maybe f found f from f thef equation f i e f =f i v f /f v f where f iv f isf thef luminousf intensity f inf candelaf andf v f isf thefluminousf efcacyfinflumens/f watt. 3.f e f=f v f/i f ffxf v f f wheref v fisfthef emittedfluminousffux,ffi f fisf electricalf forwardf currentfandf v f fisfthef forwardf voltage. absolute maximum ratings t j f=f25c parameter red/amber unit dcf forwardf current f[2] 50 ma peak f forwardf current 00 f[] ma average f forwardf current 30 ma power f dissipation 20 mw reverse f voltage f 5f v operating f temperature f range -40f tof+00 c storage f temperature f range -40f tof+00 c notes: .f dutyf factorf30%,f frequencyf khz. 2.f derate f linearlyfasf shownfinf figuref4
5 figure 1. relative intensity vs peak wavelength figure 2. forward current vs forward voltage figure 3. relative luminous intensity vs forward current figure 4. maximum forward current vs ambient temperature figure 5.radiation pattern for 15 viewing angle lamp figure 6. radiation pattern for 23 viewing angle lamp 0 . 0 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 5 0 0 5 5 0 6 0 0 6 5 0 7 0 0 w a v e l e n g t h - n m r e l a t i v e i n t e n s i t y r e d a m b e r 0 2 0 4 0 6 0 8 0 1 0 0 0 1 2 3 f o r w a r d v o l t a g e - v f o r w a r d c u r r e n t - m a 0 . 0 0 . 5 1 . 0 1 . 5 2 . 0 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0 0 2 0 4 0 6 0 8 0 1 0 0 d c f o r w a r d c u r r e n t - m a r e l a t i v e l u m i n o u s i n t e n s i t y ( n o r m a l i z e d a t 2 0 m a ) 0 1 0 2 0 3 0 4 0 5 0 6 0 0 2 0 4 0 6 0 8 0 1 0 0 t a - a m b i e n t t e m p e r a t u r e - - c i f m a x - m a x i m u m f o r w a r d c u r r e n t - m a 0 . 0 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t - d e g r e e n o r m a l i z e d i n t e n s i t y 0 . 0 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t - d e g r e e n o r m a l i z e d i n t e n s i t y
6 0 . 1 1 1 0 - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 1 4 0 t j - j u n c t i o n t e m p e r a t u r e - c r e l a t i v e l i g h t o u t p u t ( n o r m a l i z e d a t t j = 2 5 c ) r e d a m b e r - 0 . 2 0 - 0 . 1 5 - 0 . 1 0 - 0 . 0 5 0 . 0 0 0 . 0 5 0 . 1 0 0 . 1 5 0 . 2 0 - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 1 4 0 t j - j u n c t i o n t e m p e r a t u r e - c f o r w a r d v o l t a g e s h i f t - v r e d a m b e r 0 . 0 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t - d e g r e e n o r m a l i z e d i n t e n s i t y figure 7. radiation pattern for 30 viewing angle lamp relative forward voltage vs junction temperature relative light output vs junction temperature
7 intensity bin limit table (1.3:1 iv bin ratio) bin intensity (mcd) at 20ma min max v 4200 5500 w 5500 7200 x 7200 9300 y 9300 2000 z 2000 6000 6000 2000 tolerance f forfeachfbinflimitfisff5% vf bin table (v at 20ma) bin id min max vd .8 2.0 va 2.0 2.2 vb 2.2 2.4 tolerance f forfeachfbinflimitfisff0.05v red color range min dom max dom x min y min x max y max 68 630 0.6872 0.326 0.6890 0.2943 0.6690 0.349 0.7080 0.2920 tolerance f forfeachfbinflimitfisff0.5nm amber color range bin min dom max dom xmin ymin xmax ymax 584.5 587 0.5420 0.4580 0.5530 0.4400 0.5370 0.4550 0.5570 0.4420 2 587 589.5 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 4 589.5 592 0.5720 0.4270 0.5820 0.40 0.5670 0.4250 0.5870 0.430 6 592 594.5 0.5870 0.430 0.5950 0.3980 0.5820 0.40 0.6000 0.3990 tolerance f forfeachfbinflimitfisff0.5nm note: all f binf categories f are f establishedf for f classifcation f off products. f products f may f notf bef available f inf allf binf categories. f please f contact f avago f representative f forf furtherf information.f 0 . 2 8 0 0 . 3 0 0 0 . 3 2 0 0 . 3 4 0 0 . 3 6 0 0 . 3 8 0 0 . 4 0 0 0 . 4 2 0 0 . 4 4 0 0 . 4 6 0 0 . 4 8 0 0 . 5 0 0 0 . 5 5 0 0 . 6 0 0 0 . 6 5 0 0 . 7 0 0 0 . 7 5 0 0 . 8 0 0 x y 1 2 4 6 a m b e r r e d avago color bin on cie 1931 chromaticity diagram
8 precautions: lead forming: ? f the f leadsf off anf ledf lampf may f bef preformed f orf cutf to f lengthf priorf tof insertionfandf solderingfonfpcf board. ? f for f better f control, f itf isf recommended f to f usef proper f tool f to f precisely f form f andf cutf thef leadsf to f applicablef lengthf ratherfthanfdoingfitf manually. ? f if f manualf leadf cuttingf isf necessary, f cutf thef leadsf after f thef soldering f process. f the f solderf connection f forms f af mechanicalf ground f whichf prevents f mechanicalf stress f duef to f leadf cuttingf from f traveling f into f ledf package. f this f isf highlyf recommended f for f handf solderf operation, f asfthef excessfleadflengthfalsof actsfasfsmallf heatf sink. soldering and handling: ? f care f mustf bef takenf during f pcbf assemblyf andf soldering f process f to f prevent f damagef to f thef ledf component. f ? f led f component f may f bef efectively f handf soldered f to f pcb. f however, f itf isf onlyf recommended f underf unavoidable f circumstances f suchf asf rework. f the f closestf manualf soldering f distance f off thef soldering f heat f source f (soldering f irons f tip) f to f thef bodyf is f .59mm.f soldering f thef ledf usingf soldering f iron f tipf closerf thanf .59mmf mightfdamagefthef led. 1 . 5 9 m m ? f esd f precaution f mustf bef properly f appliedf onf thef soldering f station f andf personnelf to f prevent f esdf damagef to f thef ledf component f that f isf esdf sensitive. f do f refer f to f avago f application f note f an f42f for f details. f the f soldering f iron f usedf shouldf have f grounded f tipf to f ensure f electrostaticf chargefisf properlyf grounded. ? f recommended f solderingf condition: wave soldering [1, 2] manual solder dipping pre-heat f temperature 05fcf max. - preheat ftime 60fsecf max - peak f temperature 260fcf max. 260fcf max. dwell ftime 5fsecf max. 5fsecf max note: f )f abovef conditions f refers f to f measurement f withf thermocouple f mounted f atfthef bottomfoff pcb. 2)f it f isf recommended f to f usef onlyf bottom f preheaters f inf order f to f reduce f thermal f stressf experiencedf byf led. ? f wave f soldering f parameters f mustf bef setf andf maintained f according f to f thef recommended f temperature f andf dwell f time. f customer f isf advisedf to f perform f dailyf checkf onf thef soldering f profle f to f ensure f that f itf isf always f conforming f to f recommended f soldering f conditions. anode ingan device note: f .f pcbf withf diferent f size f andf design f (component f density) f willf have f diferent f heat f massf (heat f capacity). f this f might f causef af changef inf temperature f experienced f by f thef board f iff samef wave f soldering f settingf isf used. f so, f itf isf recommended f to f re-calibrate f thef soldering f profle fagainf beforefloadingfafnewf typefoff pcb. 2.f avago f technologies f highf brightness f ledf are f usingf highf efciency f ledf dief withf singlef wire f bondf asf shown f below. f customer f isf advisedf to f takef extra f precaution f during f wave f soldering f to f ensure f that f thef maximumf wave f temperature f doesf notf exceed f 260cf andf thef solderf contact f timef doesf notf exceeding f 5sec. f over-stressing f thef ledf during f soldering f process f might f causef premature f failure f to f thef ledf duef tof delamination. avago technologies led confguration f note: f electrical f connection f between f bottom f surface f off ledf dief andf thefleadf framefisf achievedf throughf conductivef paste. ? f any f alignment f fxture f that f isf beingf appliedf during f wave f soldering f shouldf bef looselyf ftted f andf shouldf notf applyf weight f orf force f onf led. f nonf metalf material f isf recommended f asf itf willf absorb f lessf heat f during f wave f solderingf process. f note: f in f order f to f further f assistf customer f inf designing f jigf accurately f that f ftf avago f technologies f product, f 3df modelf off thef product f isf available fuponf request. ? f at f elevated f temperature, f ledf isf more f susceptible f to f mechanicalf stress. f therefore, f pcbf mustf allowed f to f cool f down f to f room f temperature f prior f to f handling, f whichf includesf removalfoff alignmentf fxtureforf pallet. ? f if f pcbf board f contains f bothf through f holef (th) f ledf andf otherf surface f mount f components, f itf isf recommended f that f surface f mount f components f bef soldered f onf thef top f sidef off thef pcb. f if f surface f mount f needf to f bef onf thef bottom f side, f thesef components f shouldf bef soldered f usingf refowf solderingf priorf tof insertionfthef thf led. ? f recommended f pcf board f plated f through f holesf (pth)f size f forfledf componentf leads. led component lead size diagonal plated through hole diameter 0.45fxf0.45fmm (0.08xf0.08finch) 0.636fmm (0.025finch) 0.98f tof.08fmm (0.039f tof0.043finch) 0.50fxf0.50fmm (0.020xf0.020finch) 0.707fmm (0.028finch) .05f tof.5fmm (0.04f tof0.045finch) ? f over-sizing f thef pthf canf leadf to f twisted f ledf after f clinching. f onf thef otherf handf underf sizingf thef pthf canf causef difcultyf insertingfthef thf led.
9 refer f to f application f note f an5334f for f more f information f aboutf soldering f andf handlingf off highf brightness f thf ledf lamps. f example of wave soldering temperature profle for th led ammo packs drawing note: f the f ammo-packsf drawingfisfapplicablef forf packagingfoptionfCddf&f-zzfandf regardlessfstandofforfnon-standof r e c o m m e n d e d s o l d e r : s n 6 3 ( l e a d e d s o l d e r a l l o y ) s a c 3 0 5 ( l e a d f r e e s o l d e r a l l o y ) f l u x : r o s i n f l u x s o l d e r b a t h t e m p e r a t u r e : 2 5 5 c 5 c ( m a x i m u m p e a k t e m p e r a t u r e = 2 6 0 c ) d w e l l t i m e : 3 . 0 s e c - 5 . 0 s e c ( m a x i m u m = 5 s e c ) n o t e : a l l o w f o r b o a r d t o b e s u f f i c i e n t l y c o o l e d t o r o o m t e m p e r a t u r e b e f o r e e x e r t i n g m e c h a n i c a l f o r c e . 6 0 s e c m a x t i m e ( s e c ) 2 6 0 c m a x 1 0 5 c m a x t e m p e r a t u r e ( c )
0 packaging box for ammo packs note: f the fdimensionf forfammofpackfisfapplicablef forfthef devicefwithfstandoffandfwithoutf standof. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 6 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 6 0 c l a m p s b a b y l a b e l
disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 6 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 6 0 c l a m p s b a b y l a b e l (ii) avago baby label (only available on bulk packaging) acronyms and defnition: bin:f (i)f colorfbinfonlyforf vffbinfonly (applicable f for f part f numberf withf color f binsf butf withoutf vff binf orf part f numberf withf vff binsf andf nof color fbin) orf (ii)f colorfbinf incorporatedfwithf vffbin (applicable f for f part f numberf that f have f bothf color f binfandf vffbin) example:f (i)f colorfbinfonlyforf vffbinfonly f bin: f2f (representf colorfbinf2fonly) f bin: f vbf (representf vffbinf vb fonly) (ii)f colorfbinf incorporatefwithf vffbin f bin: f2vb f vb:f vffbinf vb f 2:ff colorfbinf2fonly for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. av02-1687en - december 12, 2008

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